Area Array Package Design
Paperback or Softback 220 pages Oct 24, 2003
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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
- Author:
- Ken Gilleo
- Publisher:
- McGraw-Hill
- Publication Date:
- Oct 24, 2003
- Number of pages:
- 220 pages
- Binding:
- Paperback or Softback
- ISBN-10:
- 0071737731
- ISBN-13:
- 9780071737739