Area Array Packaging Processes
Paperback or Softback 272 pages Oct 23, 2003
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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
- Author:
- Ken Gilleo
- Publisher:
- McGraw-Hill
- Publication Date:
- Oct 23, 2003
- Number of pages:
- 272 pages
- Binding:
- Paperback or Softback
- ISBN-10:
- 0071738010
- ISBN-13:
- 9780071738019