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Instant Bonding Epoxy Technology

by Chunfu Chen

Bentham Science Publishers

Paperback or Softback 00214 pages Mar 21, 2025

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Instant Bonding Epoxy Technology is a comprehensive guide on the chemistry, formulation, and applications of epoxy adhesive technology, focusing on instant bonding innovations. Authored by a leading expert in polymer science, the book explores the latest advancements across UV, thermal, hybrid, and ambient curing technologies.Structured into six chapters, it begins with the fundamentals of epoxy resins, curing agents, and adhesive formulations. Subsequent chapters cover UV cure cationic epoxy chemistry, dual cure hybrid systems combining UV and thermal processes, and snap thermal cure adhesives leveraging latent curing agents. Advanced topics include induction cure epoxy technology with laser and weld bonding applications, as well as snap ambient cure systems for room-temperature bonding.
Author:
Chunfu Chen
Publisher:
Bentham Science Publishers
Publication Date:
Mar 21, 2025
Number of pages:
00214 pages
Binding:
Paperback or Softback
ISBN-10:
9815313460
ISBN-13:
9789815313468