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Wafer Bonding: Applications And Technology (Springer Series In Materials Science, 75)

Wafer Bonding: Applications and Technology (Paperback)

by Marin Alexe, Ulrich G??Sele

Springer

Paperback 519 pages English Sep 30, 2011

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Author:: Marin Alexe, Ulrich G??Sele
Publisher:: Springer
Publication Date:: Sep 30, 2011
Number of pages:: 519 pages
Language:: English
Binding:: Paperback
ISBN-10:: 3642059155
ISBN-13:: 9783642059155